Overview
This is a Class H 180℃ grade 3 enamel layer round copper wire complying with JIS standards. Equipped with three layers of polyurethane insulation, it boasts outstanding dielectric strength and fewer pinhole defects for enhanced insulation safety. It features excellent direct solderability without stripping enamel, supporting fast welding at high temperature to streamline coil production. With a self-bond outer layer, the wire can stick firmly into fixed coil shapes via heat or solvent baking, eliminating extra winding fixtures. The wire delivers stable thermal shock and softening breakdown performance to sustain long-term operation under 180℃ working temperature. Its insulated outer diameter is precisely controlled within standard tolerance for smooth high-speed automatic winding. A full range of conductor sizes is available to meet diverse demands of miniature high-temperature electromagnetic components.
Specification
| Parameter | Figure |
|---|---|
| Model NO. | R-3SBUEW/H |
| Enamel Grade | 3 |
| Temperature Class (℃) | 180 |
| DC Resistance (Ω/m20℃) | 0.932~0.999 |
| Elongation (≥%) | 20 |
| Tensile Strength (>Mpa) | 240 |
| Pinhole Test (5m≤) | 0 |
Product Features
Class H 180℃ Polyurethane Insulation
The enamel film provides superior dielectric strength, low pinhole rate and stable insulation performance under long-term 180°C working environment, with reliable thermal shock and softening breakdown resistance
Excellent Direct Solderability
No enamel stripping required before soldering. The coating melts quickly at high temperature to form full, bright solder joints, greatly improving production efficiency of micro coils
Self-bonding Outer Layer
Coil shapes can be fixed by heating or solvent treatment without extra fixtures, ideal for integrated forming of miniature voice coils and inductors
Complete Conductor Size Range
Covers ultra-fine to medium gauges, customizable diameters available to satisfy various high-temperature miniature electronic winding demands
Applications
